WebApr 5, 2024 · Teledyne FLIR Adds New Boson+ Thermal Resolution Options, Radiometry, and MIPI Interface Simplifying Embedded System Integration Industry-leading 20-mK-sensitivity Boson+ with 640x512 and 320x256 resolutions is ideal for unmanned platforms, security applications, handhelds, wearables, and thermal sights April 5, 2024 Admin … WebImage sensor packages, camera lenses, compact camera modules (CCM), camera breakout boards, board camera modules, and cameras with precision housing. Interface cross conversion between DVP, MIPI, LVDS, HiSPI, SPI, and USB. Camera evaluation kits for quick proof-of-concept within minutes.
Teledyne FLIR Simplifies Embedded System Integration with New …
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Adapters / Carrier Boards Archives - Leopard Imaging Inc.
WebDSBOARD-NX2 supports up to two MIPI CSI-2 camera connections compatible with standard Raspicam pinout. Additional board level connector with UART, SPI, I2C signals is available as well. DESIGNED FOR SPEED DSBOARD-NX2 has a PCB layout design realized with all the specifications of high speed interfaces in mind. WebApr 4, 2024 · Teledyne FLIR Adds New Boson+ Thermal Resolution Options, Radiometry, and MIPI Interface Simplifying Embedded System Integration By Techmezine Industry … WebApr 13, 2024 · Teledyne FLIR añade nuevas opciones de resolución térmica, radiometría e interfaz MIPI a Boson+ para simplificar la integración en sistemas embebidos Boson+, que ofrece una sensibilidad de 20 mK, la mejor del mercado, y resoluciones de 640x512 y 320x256, es ideal para plataformas no tripuladas, aplicaciones de seguridad, … so much owed to so few